8 Weeks Training
Curriculum Overview

Mode: In-person

Location: Gainesville, FL

Workshop Overview: The course will be conducted in person at the University of Florida as a two-day workshop. Day 1 will focus on orientation, during which students will be introduced to the resources available through the Center for Autism and Related Disabilities and receive an overview of the course. They will also learn about current industry trends and be introduced to their individual mentors from industry partners. Day 2 will provide students with the opportunity to tour the University of Florida’s Nano Research Facility cleanroom and the SCAN Lab.

Mode: Online Asynchronous

Contents: Lecture + VR Virtual Lab Activity

Learning Goal: Students will explore the history of IC packaging and gain an understanding of the advanced packaging ecosystem. As part of the VR virtual lab activity, they will engage with packaging structures through gamified interactions designed to make learning both immersive and interactive.

Mode: Online Asynchronous/Synchronous

Contents: Lecture + VR Virtual Lab Activity + Group Session

Mentorship: Group Session (Zoom) – How to Find the Job

Learning Goal: Students will gain knowledge of advanced packaging technologies, including 2.5D and 3D integration and the packaging assembly process. They will also be introduced to emerging topics such as the role of AI in packaging. As part of the VR lab activity, students will engage with the Intel Foveros assembly process, experiencing it through an interactive and immersive environment.

Mode: Online Asynchronous/Synchronous

Contents: Lecture + Group Session

Mentorship: Group Session (Zoom) -- Resume Workshop

Learning Goal:  Students will explore one of the most critical topics in advanced packaging—thermal management. They will also examine how packaging design influences thermal performance and gain insight into innovative approaches in passive and hybrid cooling.

Mode: Online Asynchronous/Synchronous

Contents: Lecture + VR Virtual Lab Activity + 1-1 Session

Mentorship: One-on-One Session (Zoom) – Interview Simulation

Learning Goal:  Students will learn techniques for failure analysis in IC packaging. They will also participate in a virtual tour of the SCAN Lab through VR activities, exploring state-of-the-art equipment used for failure analysis and assurance in microelectronics.

Mode: Online Asynchronous/Synchronous

Contents: Lecture + VR Virtual Lab Activity + 1-1 Session

Mentorship: One-on-One Session (Zoom) – Interview Simulation

Learning Goal:  Students will gain an understanding of common counterfeit detection techniques and the typical issues. They will learn how to use tools such as optical microscopy and X-ray tomography for counterfeit detection and will simulate their application within an immersive, interactive VR environment.

Mode: Online Asynchronous/Synchronous

Contents: Lecture + VR Virtual Lab Activity + Group Session

Mentorship: Group Session (Zoom) – CARD Resource

Learning Goal:  Students will develop an understanding of reliability analysis in advanced packaging and semiconductor fabrication, including key failure mechanisms, testing methods, and modeling techniques. They will also learn how reliability considerations inform design decisions and manufacturing processes to ensure long-term device performance.

Mode: Hybrid 

Location: Gainesville, FL

Workshop Overview: The course will conclude with a one-day workshop at the University of Florida, organized by the Center for Autism and Related Disabilities and the Florida Semiconductor Institute. Students will have the opportunity to gain hands-on learning experience at the SCAN Lab and engage with research scientists to explore future career pathways in the semiconductor field. The employment bootcamp will also be streamed via Zoom to allow hybrid participation.